FLIR Hadron 640R+ Radiometric Drone Camera Module

  • INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE

    Collect high-speed, dual VGA radiometric thermal and HD visible imagery.

  • BUILT FOR INTEGRATORS

    Reduce development cost and time to market with a solution from a single, reliable supplier.

  • SIZE, WEIGHT, AND POWER (SWAP) OPTIMIZED DESIGN

    Optimise design and operation time with compact, lightweight, and low-power module.

Description


 

Hadron 640R+ High Performance, Dual Thermal and Visible OEM Camera Module

Teledyne FLIR has launched the next generation dual thermal and visible camera Hadron 640 series. The NEW ITAR-free radiometric Hadron 640R+ offers an industry-leading thermal sensitivity of <20 mK in a SWaP-optimized design for UAV, UGV, and robotic platform integrators.

Hadron 640R+ Remote Applications

The Hadron 640R+ pairs a 64MP visible camera with a performance-leading 640 x 512 resolution radiometric Boson or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications utilizing Teledyne FLIR Prism software.

Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA, Qualcomm, and more plus industry-leading integration support, Hadron 640 also reduces development cost and shortens time to market.

Radiometric Temperature Measurements

A radiometric thermal camera measures the temperature of a surface by interpreting the intensity of an infrared signal reaching the camera. This non-contact and non-destructive technique (NDT) gives users enormous advantages for many of their surface temperature measurement applications because it can be integrated into a FLIR drone package.

An unmanned aerial system (UAS) allows a drone operator to move and position the thermal camera to quickly make temperature measurements over large areas and in difficult or dangerous environments.

Drones fitted with an IR camera can measure:

  • Surface temperature of a heat exchanger on a roof
  • Faulty connections on a high voltage transmission line
  • Solar cells in a solar panel
  • Moisture content in large agricultural fields

 
FLIR also offers a non-radiometric solution with the FLIR Hadron 640+ Drone Camera Module.

Measuring Optically Opaque Materials

The ability to remotely sense temperature, as opposed to direct surface contact needs to factor in the surface and environmental conditions.

Radiometric measurements are best used on optically opaque materials such as metals and organic materials. Zirconia oxides, zinc sulfide glass, and sapphire glass are semi-translucent to infrared heat so radiometric measurements must account for the total volumetric and through-plane temperature of these materials. This significantly increases the complexity of the analysis.

FLIR Hadron 640R+ Technical Specifications

OVERVIEW
Thermal Imaging DetectorBoson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Radiometric
Temperature Accuracy±5 °C less, over 0 °C to 100 °C range
RADIOMETRY
Temperature Accuracy±5 °C less, over 0 °C to 100 °C range
IMAGING & OPTICAL
EO Camera OpticsKontatsu B0623D01-0, EFL 4.8mm, 67° HFOV, F/# 1/2.3
EO Camera Sensor9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
EO Camera VideoFull resolution @ 60Hz See IMX586 datasheet for more options
IMUICM20602, I2C or SPI (selectable)
IR Camera OpticsEFL 13.6mm, 32° HFOV, F/# 1.0
IR Camera VideoFull resolution @ 60Hz
Thermal Imaging DetectorBoson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Radiometric
Thermal Sensitivity<20 mK
CONNECTIONS & COMMUNICATIONS
Software DriversNVIDIA Jetson Nano
Qualcomm Snapdragon RB5
Qualcomm Snapdrago 865
ELECTRICAL
Electrical InterfaceHadron connector: Hirose DF40C-50DP-0.4V(51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V(51)
Power5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW
MECHANICAL
Mechanical InterfaceScrew mount to back plate
Size (w/o lens)35 x 49 x 45 mm
Weight56g
ENVIRONMENTAL & APPROVALS
Environmental SealingIP54 (with the rear interfaces sealed)
Operational & Storage Temperature-20°C to +60°C
Tested EMI PerformanceFCC part 15 Class B

FLIR Hadron 640R+ Datasheet

FLIR Hadron 640R+ Dual Thermal and OEM Drone Camera Module Datasheet

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