Description
Hadron 640+ High Performance, Dual Thermal and Visible OEM Camera Module
Teledyne FLIR has launched the next generation dual thermal and visible camera Hadron 640 series. The NEW ITAR-free non-radiometric Hadron 640+ offers an industry-leading thermal sensitivity of <20 mK in a SWaP-optimized design for UAV, UGV, and robotic platform integrators.
Hadron 640+ Remote Applications
The Hadron 640+ pairs a 64MP visible camera with a performance-leading 640 x 512 resolution Boson or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications utilizing Teledyne FLIR Prism software.
Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA, Qualcomm, and more plus industry-leading integration support, Hadron 640 also reduces development cost and shortens time to market.
Radiometric Temperature Measurement Version
If you need to measure radiometric temperature, FLIR also offers the Hadron 640R+ Radiometric Drone Camera Module.
A radiometric thermal camera measures the temperature of a surface by interpreting the intensity of an infrared signal reaching the camera. This non-contact and non-destructive technique (NDT) gives users enormous advantages for many of their surface temperature measurement applications because it can be integrated into a FLIR drone package.
FLIR Hadron 640+ Technical Specifications
| OVERVIEW | |
|---|---|
| Thermal Imaging Detector | Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Non-Radiometric |
| IMAGING & OPTICAL | |
| EO Camera Optics | Kontatsu B0623D01-0, EFL 4.8mm, 67° HFOV, F/# 1/2.3 |
| EO Camera Sensor | 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI |
| EO Camera Video | Full resolution @ 60 Hz |
| IMU | ICM20602, I2C or SPI (selectable) |
| IR Camera Optics | EFL 13.6mm, 32° HFOV, F/# 1.0 |
| IR Camera Video | Full resolution @ 60Hz |
| Thermal Imaging Detector | Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Non-Radiometric |
| Thermal Sensitivity | <20 mK |
| CONNECTIONS & COMMUNICATIONS | |
| Software Drivers | for NVIDIA Jetson Nano |
| for Qualcomm Snapdragon rb5 | |
| for Qualcomm Snapdrago 865 | |
| ELECTRICAL | |
| Electrical Interface | Hadron connector: Hirose DF40C-50DP-0.4V(51) |
| Example of mating connector: | DF40HC(2.5)-50DS-0.4V(51) |
| Power | 5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW |
| MECHANICAL | |
| Mechanical Interface | Screw mount to back plate |
| Size (w/o lens) | 35 x 49 x 45 mm |
| Weight | 56g |
| ENVIRONMENTAL & APPROVALS | |
| Environmental Sealing | IP54 (with the rear interfaces sealed) |
| Operational & Storage Temperature | -20°C to +60°C |
| Tested EMI Performance | FCC part 15 Class B |
FLIR Hadron 640+ Datasheet
FLIR Hadron 640+ Dual Thermal and OEM Drone Camera Module Datasheet
