FLIR Hadron 640R Dual Thermal Drone Camera Module

  • INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE

    Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.

  • BUILT FOR INTEGRATORS

    Reduce development cost and time to market with a solution from a single, reliable supplier.

  • COMPACT, LIGHTWEIGHT, AND LOW-POWER MODULE

    The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ LWIR camera portfolio.

Description

 

Hadron 640R High Performance, Dual Thermal and Visible OEM Camera Module

FLIR Hadron 640R pairs a performance-leading 640 x 512 resolution radiometric Boson thermal camera with a 64MP visible camera in a single easy-to-integrate module.

With a size, weight, and power (SWaP) optimised design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where battery life and run time are mission critical.

The Boson longwave infrared (LWIR) thermal camera provides the ability to see through total darkness, smoke, most fog, and glare as well as take the temperature of every pixel in the scene.

The 64MP visible camera imagery enables AI and machine learning for intelligent sensing applications. With drivers available for market leading processors from NVIDIA, Qualcomm, and more plus industry-leading integration support, Hadron 640R reduces development cost and shortens time to market.

 

Development Kits for Hadron 640R Dual Camera Module

For plug and play integration the FLIR Hadron 640R Development Kits alow you to pair the FLIR Hadron 640R Dual Thermal Drone Camera Module with hardware and reference software drivers.

The kits provide quick integration with development boards supporting the Qualcomm RB5, the NVIDIA Jetson Nano, and the Qualcomm Snapdragon 865. Integrators can start imaging and controlling the infrared thermal and visible camera in hours, saving potentially weeks of development time and cost.

 

Radiometric Temperature Measurements

A radiometric thermal camera measures the temperature of a surface by interpreting the intensity of an infrared signal reaching the camera. This non-contact and non-destructive technique (NDT) gives users enormous advantages for many of their surface temperature measurement applications because it can be integrated into a FLIR drone package.

An unmanned aerial system (UAS) allows a drone operator to move and position the thermal camera to quickly make temperature measurements over large areas and in difficult or dangerous environments.

Drones fitted with an IR camera can measure:

  • Surface temperature of a heat exchanger on a roof
  • Faulty connections on a high voltage transmission line
  • Solar cells in a solar panel
  • Moisture content in large agricultural fields

 

Measuring Optically Opaque Materials

The ability to remotely sense temperature, as opposed to direct surface contact needs to factor in the surface and environmental conditions.

Radiometric measurements are best used on optically opaque materials such as metals and organic materials. Zirconia oxides, zinc sulfide glass, and sapphire glass are semi-translucent to infrared heat so radiometric measurements must account for the total volumetric and through-plane temperature of these materials. This significantly increases the complexity of the analysis.

 

FLIR Hadron 640R Technical Specifications

OVERVIEW
Thermal Imaging DetectorBoson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
Temperature Accuracy±5°C less, over 0°C to 100°C range.
RADIOMETRY
Temperature Accuracy±5°C less, over 0°C to 100°C range.
IMAGING & OPTICAL
EO Camera OpticsEffective Focal Length (EFL) 4.8 mm, 67° HFOV, F/# 1/2.3
EO Camera Sensor9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
EO Camera VideoFull resolution @ 60 Hz
IMUICM20602, I2C or SPI (selectable)
IR Camera OpticsEffective Focal Length (EFL) 13.6mm, 32° HFOV, F/# 1.0
IR Camera VideoFull resolution @ 60Hz
Thermal Imaging DetectorBoson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
CONNECTIONS & COMMUNICATIONS
Software DriversNVIDIA Jetson Nano
Qualcomm Snapdragon rb5
Qualcomm Snapdragon 865
*Contact GTEK Infrared for latest software drivers
ELECTRICAL
Electrical InterfaceHirose DF40C-50DP-0.4V (51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V (51)
Power5V, typical power dissipation <1800 mW, Max <2900 mW
MECHANICAL
Mechanical InterfaceScrew mount to back plate
Size (w/o lens)35 x 49 x 45 mm (1.38” x 1.93” x 1.77”)
Weight56 g
ENVIRONMENTAL & APPROVALS
Environmental SealingIP54 (with the rear interfaces sealed)
Operational & Storage Temperature-20°C to +60°C
Tested EMI PerformanceFCC part 15 Class B

 

US Export Compliance for Thermal Imagers

As a global trade compliant product, there is paperwork to complete and submit prior to the purchase of this FLIR product.

If you are interested, please don’t hesitate to contact one of our friendly staff who can answer any questions you have, and step you through the process.

 

FLIR Hadron 640R Datasheet

FLIR Hadron 640R Dual Thermal and OEM Drone Camera Module Datasheet

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